Miniaturization of Porous to Transparent Ceramics for Structural and Functional Applications

About This Course

This course covers powder consolidation and sintering routes for miniaturized ceramics—ranging from porous bodies to optically transparent ceramics. You’ll learn major consolidation methods (uniaxial/isostatic pressing, hot pressing, HIP, SPS, cold sintering) and advanced fabrication workflows (CNC machining, additive manufacturing, micro-scale processing). The course also explores how these manufacturing choices influence mechanical, electrical, optical, and thermal properties—enabling applications in advanced sensors and electronic devices.

Aim

To provide a comprehensive understanding of powder consolidation, sintering, and advanced manufacturing techniques used to produce miniaturized porous-to-transparent ceramics, and to map these techniques to structural and functional applications.

Course Objectives

• Introduce powder consolidation techniques, with advantages and limitations

• Explain sintering processes and key influencing factors (temperature, time, pressure, atmosphere)

• Build understanding of advanced manufacturing protocols (CNC, 3D printing, microinjection molding, micromachining)

• Connect processing choices to ceramic properties (mechanical/electrical/optical/thermal) and optimization strategies

Course Structure

Module 1: Powder Consolidation and Sintering

• Uniaxial & Isostatic Pressing + Fundamentals of Sintering

• Hot Pressing

• Hot-Isostatic Pressing (HIP)

• Spark Plasma Sintering (SPS)

• Cold Sintering

• CNC Machining (role in miniaturized ceramics: tolerances, surface finish, feature creation)

Module 2: Advanced Manufacturing Protocols

• 3D Printing (ceramics overview: feedstocks, binders, debinding)

• Selective Laser Sintering

• Stereolithography (resin systems, green body quality, shrinkage control)

• Atomic Layer Deposition (ALD)

• Microinjection Molding

• Micromachining

• Grinding & Polishing

Module 3: Characterization, Optimization, and Applications (added to match the 3-day duration)

• Microstructure, Porosity & Density Measurement (what to measure and why)

• Optical Transparency Pathway: scattering sources, pore elimination, grain boundary control

• Property Testing Overview: mechanical/thermal/electrical/optical performance mapping

• Process–Property Optimization: common defects, warpage/shrinkage, cracking, delamination

• Application Mapping + Mini Case Studies: sensors, electronic substrates, functional ceramic micro-components

• Scale-up considerations: repeatability, process windows, quality control checkpoints

Who Should Enrol?

Students, Researchers, PhD Scholars, Academicians, Research Scientists, Industry Professionals