Program Structure

Module 1: Spintronics in One Clear Picture

• Why conventional electronics is hitting limits (power, heat, scaling).
• Charge vs spin: what changes when “spin becomes information.”
• Key spintronic advantages: non-volatility, speed, low power (concept-level).
• Applications landscape: memory, sensors, logic, neuromorphic ideas.

Module 2: Nanoscale Magnetism Essentials

• Magnetic domains, anisotropy, coercivity—explained simply.
• Thin films and multilayers: why thickness and interfaces matter.
• Exchange coupling and interlayer interactions (big picture view).
• Thermal stability challenges at nanoscale dimensions.

Module 3: Spin-Dependent Transport (The Heart of Devices)

• Spin polarization and scattering: why resistance changes with magnetization.
• GMR (Giant Magnetoresistance): how multilayers unlocked modern sensors.
• TMR (Tunneling Magnetoresistance): how tunnel barriers enable MTJs.
• Spin diffusion and relaxation: what limits signal quality.

Module 4: Nanotechnology Tools That Enable Spintronics

• Thin film deposition basics (high-level): sputtering, evaporation, ALD concepts.
• Patterning and lithography: why clean edges and uniformity matter.
• Interface engineering: roughness, oxidation, contamination, and performance loss.
• Stack design thinking: choosing materials for each layer’s job.

Module 5: Magnetic Tunnel Junctions (MTJs) and MRAM

• MTJ structure: free layer, barrier, pinned layer (what each does).
• Switching mechanisms overview: STT-MRAM vs SOT-MRAM (conceptual differences).
• Read/write challenges: endurance, retention, write current, and variability.
• Where MRAM fits: embedded memory, low-power devices, edge computing.

Module 6: Spin-Orbitronics and Next-Gen Switching

• Spin–orbit coupling: why heavy metals and interfaces are powerful.
• Spin Hall effect and Rashba effects (high-level intuition).
• Spin–orbit torque (SOT): faster switching paths and scaling benefits.
• Materials trends: Pt, Ta, W, and engineered interfaces for higher efficiency.

Module 7: Skyrmions, Topological Materials, and 2D Spintronics

• Skyrmions: “nano-magnetic whirlpools” and why people love them for memory/logic.
• Topological insulators and protected edge states (concept-level benefits for spin transport).
• 2D materials (graphene, TMDs): spin transport, proximity effects, and device concepts.
• What’s real today vs what’s still research-stage (industry reality check).

Module 8: Characterization and Reliability (How We Prove It Works)

• Electrical testing: IV curves, magnetoresistance loops, switching measurements.
• Magnetic characterization overview: MOKE, VSM, SQUID (what they tell you).
• Structural analysis: TEM/SEM/AFM basics for interfaces and thickness verification.
• Reliability: aging, thermal drift, endurance cycles, and failure modes.

Module 9: Designing Spintronic Products and Research Roadmaps

• Device-to-system thinking: memory arrays, sensors, and integration constraints.
• Energy and performance metrics: what matters for real deployment.
• Manufacturing scalability: uniform films, yield, defect control, cost.
• Future directions: spintronic logic, neuromorphic hardware, quantum links (concept-level).

Final Project

• Create a Spintronic Device Concept Brief (MRAM cell, magnetic sensor, or skyrmion-based memory idea).
• Include: target application, materials stack, fabrication approach (high-level), expected performance metrics, and a testing plan.
• Example themes: “low-power MTJ sensor for biomedical signals,” “SOT-MRAM cell stack optimization,” or “skyrmion racetrack memory concept.”